General Information:
Authors should prepare a 6-page camera-ready paper
for inclusion in the conference proceedings of both the Main Conference,
as well as the Post-Conference workshop. Manuscripts are
limited to 6 pages for each paper.
Each 6-page paper must be submitted in an electronic format ( WORD, or LaTex), DIRECTLY to the Publishers (Techscience Press- TSP) for typesetting. Submision of the 6-page paper to TSP automatically implies the transfer of ALL (printed and electronic) the copyrights (with the exception of authors employed by the US Government), to TSP. The publishers' web-site is:
http://submission.techscience.com/icces07
These manuscripts will be reviewed by the ICCES07 Scientific Committee, and decisions of acceptability will be transmitted to the authors, directly from the publishers' web-site. This will considerably simplify the procedures that were otherwise followed in earlier ICCES.
Instructions for paper preparation:
Detailed instructions for the paper preparation for ICCES'07 are
available in a PDF document. Please follow this link to download
the PDF document.
Please follow this link to download the PDF document.
Following are the links to various templates and sample files.
- LaTeX2e Document Class (style file)
- Sample LaTeX document
- Sample PDF document
- Sample MS Word document
Journal publication of selected full (unlimited) length papers
Based on the review of the 6-page ICCES'07-Miami proceedings papers, authors of
certain selected papers will be invited to submit their full (unlimited) length papers for possible publication in one of the following journals:
CMES: Computer Modeling in Engineering & Sciences
CMC: Computers, Materials & Continua
MCB: Mechanics & Chemistry of Biosystems
SDHM: Structural Durability & Health Monitoring
For further details on all these journals, please visit: http://www.techscience.com
Looking forward to your contribution.
ICCES'07
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